IS66WV51216DBLL-55BLI

Density 8M
Org 512Kx16
Pkg(Pins) BGA
Vcc 1.7-1.95V
Solder Lead-free (RoHS Compliant)
Status Prod
Comment Standard Asynch, IS66WV51216ALL/BLL
Die Rev D
Speed(ns) 70
Temp.Range Industrial Grade (-40C to +85°C)
Voltage Range 2.2V (2.4V/2.5V) to 3.6V
Product Family Pseudo SRAM
Item 66 = Pseudo SRAM/HyperRAM™
Revision D = D
ROHS Version L = true
Product Type WV = Standard Asynch PSRAM
Temperature Range I = Industrial (-40°C to 85°C)
Vdd(V) BLL = 3V
Density Configuration 51216 = 8Mb /512K x16
Package Code B = 48 TFBGA 6x8

IS66WV51216DBLL-55BLI Features

  • High-speed access time:
    • 70ns (IS66WV51216DALL, IS66/67WV51216DBLL)
    • 55ns (IS66/67WV51216DBLL)
  • CMOS low power operation
  • Single power supply
    • Vdd = 1.7V-1.95V (IS66WV51216dALL)
    • Vdd = 2.5V-3.6V (IS66/67WV51216dBLL)
  • Three state outputs
  • Data control for upper and lower bytes
  • Industrial temperature available

Overview

The ISSI IS66WV51216DALL and IS66/67WV51216DBLL are high-speed, 8M bit static RAMs organized as 512K words by 16 bits. It is fabricated using ISSI's high- performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. When CS1 is HIGH (deselected) or when CS2 is LOw (deselected) or when CS1 is LOw, CS2 is HIGH and both LB and UB are HIGH, the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs. The active LOw write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The IS66wV51216DALL and IS66/67wV51216DBLL are packaged in the JEDEC standard 48-ball mini BGA (6mm x 8mm) and 44-Pin TSOP (TYPE II). The device is aslo available for die sales.