IS43DR16640D-25DBL

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Density 1G
Org 64Mx16
Vcc 1.8V
Type DDR2
Refresh 8K
Speed 25 = 400MHz
Status Prod
Pkg Pins BGA(84)
Comment Previous Rev
Temp. Grade blank = Commercial Grade (0°C to +70°C)
Solder Type L = SnAgCu
Number Of Words 640 = 64M
CL (CAS Latency) D = 5
Operating Voltage Range DR = 1.8V DDR2
Generation D = D
Bus Width 16 = x16
Package Type B = BGA
Product Family 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade

IS43DR16640D-25DBL Features

  • Standard Voltage: Vdd and Vddq = 1.8V ±0.1V DESCRIPTION ISSI's 1Gb DDR2 SDRAM uses a double-data-rate
  • Low Voltage (L): Vdd and Vddq = 1.5V ±0.075V architecture to achieve high-speed operation. The
  • SSTL_18-compatible for Standard Voltage double-data rate architecture is essentially a 4n-prefetch
  • SSTL_15-compatible for Low Voltage architecture, with an interface designed to transfer two
  • Double data rate interface: two data transfers per clock data words per clock cycle at the I/O balls. cycle
  • Differential data strobe (DQS, DQS) ADDRESS TABLE
  • 4-bit prefetch architecture Parameter 128M x 8 64M x 16
  • On chip DLL to align DQ and DQS transitions with CK Configuration 16M x 8 x 8 8M x 16 x 8
  • 8 internal banks for concurrent operation banks banks
  • Programmable CAS latency (CL) 3, 4, 5, 6 and 7 sup- Refresh Count 8K/64ms 8K/64ms ported Row Addressing 16K (A0-A13) 8K (A0-A12)
  • Programmable CAS latency (CL) 3, 4, 5, 6, 7, 8 and 9 Column Addressing 1K (A0-A9) 1K (A0-A9) supported Bank Addressing BA0 - BA2 BA0 - BA2
  • Posted CAS and programmable additive latency (AL) Precharge Addressing A10 A10 0, 1, 2, 3, 4, 5 and 6 supported
  • WRITE latency = READ latency - 1 tCK
  • Programmable burst lengths: 4 or 8 KEY TIMING PARAMETERS
  • Adjustable data-output drive strength, full and reduced Speed Grade -18F -22E -25D strength options tRCD 13.125 13.33 12.5
  • On-die termination (ODT) tRP 13.125 13.33 12.5 tRC 51.25 55 55 OPTIONS
  • Configuration(s): tRAS 40 40 40 128Mx8 (16Mx8x8 banks) tCK @CL=3 X 5 5 64Mx16 (8Mx16x8 banks) tCK @CL=4 3.75 3.75 3.75
  • Package: tCK @CL=5 2.5 2.5 2.5 x8: 60-ball BGA (8mm x 10.5mm) x16: 84-ball WBGA (8mm x 12.5mm) tCK @CL=6 2.2 2.2 2.5
  • Timing
    • Cycle time tCK @CL=7 1.875 2.2 — 1.8ns @CL=7 DDR2-1066F Note: Faster speed options are backward compatible to slower speed 2.2ns @CL=6 DDR2-900E options 2.5ns @CL=5 DDR2-800D

Overview

Read and write accesses to the DDR2 SDRAM are burst oriented; accesses start at a selected location and continue for a burst length of four or eight in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the active command are used to select the bank and row to be accessed (BA0-BA2 select the bank; A0-A12(x16) or A0-A13(x8) select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location A0-A9 for the burst access and to determine if the auto precharge A10 command is to be issued. Prior to normal operation, the DDR2 SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.

 

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