IS43TR16640ED-125KBLI-TR

Density 1G
Org 64Mx16
Vcc 1.5V
Type DDR3
Refresh 8K
Speed 125 = 800MHz
Status Prod
Comment ECC
Pkg Pins BGA(96)
Operating Voltage Range TR = 1.5V DDR3
Bus Width 16 = x16
Product Family 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade
Generation ED = ED
Package Type B = BGA
Temp. Grade I = Industrial Grade (-40°C to +85°C)
Solder Type L = SnAgCu
Number Of Words 640 = 64M
CL (CAS Latency) K = 11
Outpack Tape on Reel

IS43TR16640ED-125KBLI-TR Features

  • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
  • High speed data transfer rates with system frequency up to 800 MHz
  • 8 internal banks for concurrent operation
  • 8n-bit pre-fetch architecture
  • Programmable CAS Latency
  • Programmable Additive Latency: 0, CL-1,CL-2
  • Programmable CAS WRITE latency (CWL) based on tCK
  • Programmable Burst Length: 4 and 8
  • Programmable Burst Sequence: Sequential or Interleave
  • BL switch on the fly
  • Auto Self Refresh(ASR)
  • Self Refresh Temperature(SRT) ECC
  • Single bit error correction (per 64-bits)
  • Restrictions on Burst Length and Data Mask OPTIONS
  • Configuration: 128Mx8 64Mx16
  • Package: 96-ball FBGA (9mm x 13mm) for x16 78-ball FBGA (8mm x 10.5mm) for x8 SPEED BIN Speed Option 15H 125K MARCH 2018
  • Refresh Interval: 7.8 μs (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 μs (8192 cycles/32 ms) Tc= 85°C to 105°C 1.95 μs (8192 cycles/16ms)Tc=105°C to 125°C
  • Partial Array Self Refresh
  • Asynchronous RESET pin
  • TDQS (Termination Data Strobe) supported (x8 only)
  • OCD (Off-Chip Driver Impedance Adjustment)
  • Dynamic ODT (On-Die Termination)
  • Driver strength : RZQ/7, RZQ/6 (RZQ = 240  )
  • Write Leveling
 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS43TR16640ED-125KBLI 7 IS43TR16640ED-15HBLI-TR 1,311
IS43TR16640ED-15HBLI 74