1. ISSI
  2. Flash
  3. Flash
  4. Twin Quad Serial NOR (x8 SPI)
  5. 2.3-3.6V
  6. 512M
  7. SOIC-16 300mil
  8. IS25DLP512M-CMLE

  IS25DLP512M-CMLE

Datasheet
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Density 512M
Vcc 2.3-3.6V
Type Multi I/O SPI, QPI, DTR
Status Prod
Comment
Frequency 80M/166Mhz
Temp Range -40 to 125°C
Package Type SOIC, TFBGA
Package Code M = SOIC-16 300mil
Option C = 2 CE#
Temperature Range E = Extended (-40°C to +105°C)
ROHS Version L = true
Vdd(V) DLP = 2.3V-3.6V
Density Configuration 512M = 512M
Product Family 25 = Twin SPI Flash
Revision = First Generation
Datasheet
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IS25DLP512M-CMLE Features

  • Industry Standard Serial Interface
  • Efficient Read and Program modes
  • - IS25DLP/DWP512M: 512Mbit/64Mbyte - Dual Die Stack of two IS25LP/WP256D - Supports standard SPI and QPI protocols - Double Transfer Rate (DTR) : SPI DTR, Dual I/O SPI DTR , and Quad I/O SPI DTR - Low Instruction Overhead Operations - QPI for reduced instruction overhead - Continuous Read 8/16/32/64-Byte Burst Wrap - Selectable burst length - Supports Serial Flash Discoverable
  • Low Power with Wide Temp. Parameters (SFDP)
  • - Support Hardware RESET# Feature
  • High Performance Serial Flash (SPI)
  • - 80MHz Normal Read - Up to166Mhz Fast Read: -166MHz at Vcc=2.7V to 3.6V (1) -133MHz at Vcc=2.3V to 3.6V -133MHz at Vcc=1.65V to 1.95V (2) - Up to 80MHz DTR (Dual Transfer Rate) - Equivalent Throughput of 664 Mb/s - Selectable Dummy Cycles - Configurable Drive Strength - Supports SPI Modes 0 and 3 - More than 100,000 Erase/Program Cycles - More than 20-year Data Retention
  • Flexible & Efficient Memory Architecture
  • - Chip Erase with Uniform: Sector/Block Erase (4/32/64 Kbyte) - Program 1 to 256 bytes per page per die - Program/Erase Suspend & Resume Ranges - Single Voltage Supply IS25DLP: 2.30V to 3.60V IS25DWP: 1.65V to 1.95V - 10 mA Active Read Current per die - 8 µA Standby Current per die - 1 µA Deep Power Down per die - Temp Grades: Extended: -40°C to +105°C Auto Grade (A2): -40°C to +105°C Auto Grade (A3): -40°C to +125°C
  • Advanced Security Protection
  • - Software and Hardware Write Protection - Power Supply lock protect - 4x256-Byte dedicated security area per die with user-lockable bits, (OTP) One Time Programmable Memory - 128 bit Unique ID for each device (Call Factory)

Overview

This document contains for the IS25DLP/DWP512M device. The device is a dual die stack of two IS25LP/WP256D dies. For detailed specifications, please refer to the discrete die datasheet linked below.

 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS25DLP512M-CMLE-TR IS25DLP512M-CMLA2-TR
IS25DLP512M IS25DLP512M-CMLA3
IS25DLP512M-CMLA2 IS25DLP512M-CMLA3-TR