| Density | 256M |
|---|---|
| Vcc | 1.65-1.95V |
| Type | Multi I/O SPI, QPI, DTR |
| Status | Contact Factory |
| Comment | |
| Frequency | 80M/166Mhz |
| Temp Range | -40 to 125°C |
| Package Type | SOIC, TFBGA |
| Package Code | M = SOIC-16 300mil |
| Outpack | Tape on Reel |
| Option | C = 2 CE# |
| Temperature Range | E = Extended (-40°C to +105°C) |
| ROHS Version | L = true |
| Vdd(V) | DWP = 1.65V-1.95V |
| Density Configuration | 256M = 256M |
| Product Family | 25 = Twin SPI Flash |
| Revision | = First Generation |
This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.
| Description | Stock Qty | Available Qty |
|---|---|---|
| IS25DWP256M-CMLE |