Vcc | 1.65-1.95V |
---|---|
Status | S=Q4/17 |
Frequency | 80M/166Mhz |
Type | Multi I/O SPI, QPI, DTR |
Temp.Range | -40 to 125°C |
Package Type | SOIC , TFBGA |
Revision | = First Generation |
Vdd(V) | DWP = 1.65V-1.95V |
Density Configuration | 512M = 512M |
Product Family | 25 = Twin SPI Flash |
This document contains for the IS25DLP/DWP512M device. The device is a dual die stack of two IS25LP/WP256D dies. For detailed specifications, please refer to the discrete die datasheet linked below.