IS42SM32200G-75BLI-TR

Org	2Mx32
Pkg(Pins)	BGA(90)
Vcc	3.3V
Refresh	4K
No. of Words	2M
Solder	SnAgCu
Status	Contact ISSI
Outpack	Tape on Reel
Type	MSDR
Bus Width	32 = x32
Speed(Mhz)	up to 133Mhz @ CL2
Temp.Range	Industrial Grade (-40C to +85°C)
Generation/Rev	G
Product Family	42 = SDR Commercial/Industrial grade
Temp. Grade	I = Industrial Grade (-40°C to +85°C)
Solder Type	L = SnAgCu
Generation	G = G
Number Of Words	200 = 2M
Speed	75 = 133Mhz
Operating Voltage Range	SM = 3.3V
Package Type	B = BGA

Datasheet

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IS42SM32200G-75BLI-TR Features

Auto refresh and self refresh.
All pins are compatible with LVCMOS interface.
4K refresh cycle / 64ms.
Programmable Burst Length and Burst Type.
- 1, 2, 4, 8 or Full Page for Sequential Burst. - 4 or 8 for Interleave Burst. y /
Programmable CAS Latency : 2,3 clocks.
Programmable Driver Strength Control
- Full Strength or 1/2, 1/4 of Full Strength
Deep Power Down Mode
Deep Power Down Mode.
All inputs and outputs referenced to the positive edge of the system clock.
Data mask function by DQM.
Internal 4 banks operation
Internal 4 banks operation.
Burst Read Single Write operation.
Special Function Support.
- PASR(Partial Array Self Refresh) - Auto TCSR(Temperature Compensated Self Refresh)

Overview

These IS42SM32200G are Low Power 67,108,864 bits CMOS Synchronous DRAM organized as 4 banks of 524,288 words x 32 bits. These products are offering fully synchronous operation and are referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve high bandwidth. All input and output voltage levels are compatible with LVCMOS.