1. ISSI
  2. SRAM
  3. QUAD/QUADP and DDR-II/DDR-IIP
  4. QUADP
  5. 18M 512Kx36
  6. 165 ball BGA (13 x 15 mm)
  7. IS61QDP2B251236C1-400B4

  IS61QDP2B251236C1-400B4

Datasheet
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Density 18M
Org 512Kx36
Burst 2
Status Prod
Speed Mhz 300, 333, 400, 450
Comments Previous Revision 2.0 Cycle Read Latency
Package Code B4 = 165 ball BGA (13 x 15 mm)
ROHS Version = Leaded
Burst Type B2 = Burst 2
Die Rev C = C
Read Latency (RL) 2 = 2.0 clock cycles
ODT Option 1 = ODT Option 1 If ODT = HIGH or floating, a high range termination resistance is selected. If ODT = LOW, a low range termination resistance is selected.
Product Type QDP = QUADP
Configuration 51236 = 512K x36
Temperature Range blank = Commercial (0°C to 70°C)
Speed 400 = 400MHz
Product Family 61 = QUAD/P DDR-2/P
Datasheet
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IS61QDP2B251236C1-400B4 Features

  • 512Kx36 and 1Mx18 configuration available.
  • On-chip Delay-Locked Loop (DLL) for wide data valid window.
  • Separate independent read and write ports with concurrent read and write operations.
  • Synchronous pipeline read with EARLY write operation.
  • Double Data Rate (DDR) interface for read and write input ports. 2.0 Cycle read latency.
  • Fixed 2-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data.
  • Data valid pin (QVLD).
  • HSTL input and output interface.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs. The following are registered internally on the rising edge of the K clock:
  • Read address
  • Read enable
  • Write enable
  • Data-in for early writes The following are registered on the rising edge of the K# clock:
  • Write address
  • Byte writes
  • Data-in for second burst addresses
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1 functions.
  • Byte Write capability.
  • Fine ball grid array (FBGA) package option: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Programmable impedance output drivers via 5x user- supplied precision resistor.
  • ODT (On Die Termination) feature is supported

Overview

The are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the.

 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS61QDP2B251236C-333B4 IS61QDP2B251236C1-333B4LI-TR
IS61QDP2B251236C-333B4-TR IS61QDP2B251236C1-333M3
IS61QDP2B251236C-333B4I IS61QDP2B251236C1-333M3-TR
IS61QDP2B251236C-333B4I-TR IS61QDP2B251236C1-333M3I
IS61QDP2B251236C-333B4L IS61QDP2B251236C1-333M3I-TR
IS61QDP2B251236C-333B4L-TR IS61QDP2B251236C1-333M3L
IS61QDP2B251236C-333B4LI IS61QDP2B251236C1-333M3L-TR
IS61QDP2B251236C-333B4LI-TR IS61QDP2B251236C1-333M3LI
IS61QDP2B251236C-333M3 IS61QDP2B251236C1-333M3LI-TR
IS61QDP2B251236C-333M3-TR IS61QDP2B251236C2-333B4
IS61QDP2B251236C-333M3I IS61QDP2B251236C2-333B4-TR
IS61QDP2B251236C-333M3I-TR IS61QDP2B251236C2-333B4I
IS61QDP2B251236C-333M3L IS61QDP2B251236C2-333B4I-TR
IS61QDP2B251236C-333M3L-TR IS61QDP2B251236C2-333B4L
IS61QDP2B251236C-333M3LI IS61QDP2B251236C2-333B4L-TR
IS61QDP2B251236C-333M3LI-TR IS61QDP2B251236C2-333B4LI
IS61QDP2B251236C-400B4 IS61QDP2B251236C2-333B4LI-TR
IS61QDP2B251236C-400B4-TR IS61QDP2B251236C2-333M3
IS61QDP2B251236C1-333B4 IS61QDP2B251236C2-333M3-TR
IS61QDP2B251236C1-333B4-TR IS61QDP2B251236C2-333M3I
IS61QDP2B251236C1-333B4I IS61QDP2B251236C2-333M3I-TR
IS61QDP2B251236C1-333B4I-TR IS61QDP2B251236C2-333M3L
IS61QDP2B251236C1-333B4L IS61QDP2B251236C2-333M3L-TR
IS61QDP2B251236C1-333B4L-TR IS61QDP2B251236C2-333M3LI
IS61QDP2B251236C1-333B4LI IS61QDP2B251236C2-333M3LI-TR
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