IS42S16400N-6TLI-TR

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Density 64M
Org 4Mx16
Vcc 3.3V
Type SDR
Refresh 4K
Speed 6 = 166MHz
Status Prod
Comment
Pkg Pins TSOP2(54), BGA(54)
Temp. Grade I = Industrial Grade (-40°C to +85°C)
Solder Type L = 100% matte Sn
Number Of Words 400 = 4M
Operating Voltage Range S = 3.3V SDR
Generation N = N
Bus Width 16 = x16
Package Type T = TSOP
Product Family 42 = SDR Commercial/Industrial grade
Outpack Tape on Reel

IS42S16400N-6TLI-TR Features

  • Clock frequency: 200, 166, 143, 133 MHz ISSI's 64Mb Synchronous DRAM is organized as 1,048,576 bits x 16-bit x 4-bank for improved performance. The
  • Fully synchronous; all signals referenced to a synchronous DRAMs achieve high-speed data transfer positive clock edge using pipeline architecture. All inputs and outputs signals
  • Internal bank for hiding row access/precharge refer to the rising edge of the clock input.
  • Single 3.3V power supply
  • LVTTL interface
  • Programmable burst length
    • (1, 2, 4, 8, full page) KEY TIMING PARAMETERS
  • Programmable burst sequence: Parameter -5 -6 -7 Unit Sequential/Interleave Clk Cycle Time
  • Self refresh modes CAS Latency = 3 5 6 7 ns CAS Latency = 2 7.5 7.5 7.5 ns
  • Auto refresh (CBR) Clk Frequency
  • 4096 refresh cycles every 64 ms (Com, Ind, A1 CAS Latency = 3 200 166 143 Mhz grade) or 16ms (A2 grade) CAS Latency = 2 133 133 133 Mhz
  • Random column address every clock cycle Access Time from Clock
  • Programmable CAS latency (2, 3 clocks) CAS Latency = 3 4.8 5.4 5.4 ns
  • Burst read/write and burst read/single write CAS Latency = 2 5.4 5.4 5.4 ns operations capability
  • Burst termination by burst stop and precharge command ADDRESS TABLE OPTIONS Parameter 4M x 16
  • Green Package: Configuration 1M x 16 x 4 54-pin TSOP II banks 54-ball TF-BGA (8mm x 8mm) Refresh Count 60-ball TF-BGA (10.1mm x 6.4mm) Com./Ind. 4K/64ms
 

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