IS45S32800L-6BLA1-TR

Buy
Density 256M
Org 8Mx32
Vcc 3.3V
Type SDR
Refresh 4K
Speed 6 = 166MHz
Status S=Q2/24
Comment
Pkg Pins TSOP(54), BGA(90)
Temp. Grade A1 = Automotive Grade (-40°C to +85°C)
Solder Type L = SnAgCu
Number Of Words 800 = 8M
Operating Voltage Range S = 3.3V SDR
Generation L = L
Bus Width 32 = x32
Package Type B = BGA
Product Family 45 = SDR Automotive grade
Outpack Tape on Reel

IS45S32800L-6BLA1-TR Features

  • Clock frequency: 200, 166, 143, 133 MHz ISSI's 256Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and
  • Fully synchronous; all signals referenced to a outputs signals refer to the rising edge of the clock input. positive clock edge The 256Mb SDRAM is organized in 2Meg x 32 bit x 4
  • Internal bank for hiding row access/precharge Banks.
  • Single Power supply: 3.3V + 0.3V
  • LVTTL interface KEY TIMING PARAMETERS
  • Programmable burst length Parameter -5 -6 -7 Unit
    • (1, 2, 4, 8, full page) Clk Cycle Time
  • Programmable burst sequence: CAS Latency = 3 5 6 7 ns CAS Latency = 2 10 10 7.5 ns Sequential/Interleave Clk Frequency
  • Auto Refresh (CBR) CAS Latency = 3 200 166 143 Mhz
  • Self Refresh CAS Latency = 2 100 100 133 Mhz
  • 4096 refresh cycles every 16ms (A2 grade) or Access Time from Clock 64 ms (Commercial, Industrial, A1 grade) CAS Latency = 3 4.8 5.4 5.4 ns CAS Latency = 2 6.5 6.5 5.5 ns
  • Random column address every clock cycle
  • Programmable CAS latency (2, 3 clocks)
  • Burst read/write and burst read/single write operations capability ADDRESS TABLE
  • Burst termination by burst stop and precharge Parameter 8M x 32 command Configuration 2M x 32 x 4 banks OPTIONS Refresh Count Com./Ind. 4K / 64ms
  • Package: A1 4K / 64ms 90-ball TF-BGA A2 4K / 16ms 86-pin TSOP2 Row Addresses A0
    • A11
 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS45S32800L-6BLA1 IS45S32800L-7BLA2
IS45S32800L-7BLA1 IS45S32800L-7BLA2-TR
IS45S32800L-7BLA1-TR