電壓 | 1.65-1.95V |
---|---|
狀態 | S=Q4/17 |
外包裝 | Tape on Reel |
频率 | 80M/166Mhz |
類型 | Multi I/O SPI, QPI, DTR |
温規 | -40 to 125°C |
腳位/封裝 | SOIC , TFBGA |
Revision | = First Generation |
電壓 - 電源 | DWP = 1.65V-1.95V |
密度配置 | 512M = 512M |
產品系列 | 25 = Twin SPI Flash |
This document contains for the IS25DLP/DWP512M device. The device is a dual die stack of two IS25LP/WP256D dies. For detailed specifications, please refer to the discrete die datasheet linked below.