IS61DDP2B21M36C-400B4I

容量 36M
規格 1Mx36
2
狀態 Prod
速度Mhz 300, 333, 400, 450
評論上一版本 2.0 Cycle Read
產品系列 61 = QUAD/P DDR-2/P
配置 1M36 = 1M x36
包裝代碼 B4 = 165 ball BGA (13 x 15 mm)
ROHS版 = Leaded
突發類型 B2 = Burst 2
硅片版本 C = C
讀延時(RL) 2 = 2.0 clock cycles
ODT選項 blank = No ODT
產品類別 DDP = DDR-IIP, Common I/O
溫度範圍 I = Industrial (-40°C to +85°C)
速度 400 = 400MHz

IS61DDP2B21M36C-400B4I 特徵

  • 1Mx36 and 2Mx18 configuration available.
  • Common I/O read and write ports.
  • Max. 500 MHz clock for high bandwidth
  • Synchronous pipeline read with self-timed late write operation.
  • Double Data Rate (DDR) interface for read and write input ports. 2.0 cycle read latency. Fixed 2-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data. +1.8V core power supply and 1.5, 1.8V VDDQ, used with 0.75, 0.9V VREF.
  • Read/write address
  • Read enable
  • Write enable
  • Byte writes
  • Registered addresses, write and read controls, byte
  • Data-in for first burst address writes, data in, and data outputs.
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1
  • Data-Out for first burst address The following are registered on the rising edge of the K# clock: functions.
  • Byte write capability.
  • Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Programmable impedance output drivers via 5x user- supplied precision resistor.
  • Data Valid Pin (QVLD).
  • ODT (On Die Termination) feature is supported optionally on data input, K/K#, and BWx#.
  • The end of top mark (C/C1/C2) is to define options. IS61DDP2B21M36C : Don’t care ODT function and pin connection IS61DDP2B21M36C1: Option1 IS61DDP2B21M36C2: Option2 Refer to more detail description at page 6 for each ODT option.
  • Byte writes
  • Data-in for second burst address

概觀

The 36Mb IS61DDP2B21M36C/C1/C2 and IS61DDP2B22M18C/C1/C2 are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self- timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these DDR-IIP (Burst of 2) CIO SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock:

 

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IS61DDP2B21M36C-400M3L-TR IS61DDP2B21M36C2-400B4I-TR
IS61DDP2B21M36C-400M3LI 10,000 IS61DDP2B21M36C2-400B4L
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IS61DDP2B21M36C-450B4 IS61DDP2B21M36C2-400B4LI
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IS61DDP2B21M36C1-400B4I IS61DDP2B21M36C2-400M3I
IS61DDP2B21M36C1-400B4I-TR IS61DDP2B21M36C2-400M3I-TR
IS61DDP2B21M36C1-400B4L IS61DDP2B21M36C2-400M3L
IS61DDP2B21M36C1-400B4L-TR IS61DDP2B21M36C2-400M3L-TR
IS61DDP2B21M36C1-400B4LI IS61DDP2B21M36C2-400M3LI
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