IS25DWP512M-CMLA3

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容量	512M
電壓	1.65-1.95V
類型	Multi I/O SPI, QPI, DTR
狀態	Contact Factory
評注
频率	80M/166Mhz
溫度範圍	-40 to 125°C
腳位類型	SOIC , TFBGA
包裝代碼	M = SOIC-16 300mil
Option	C = 2 CE#
溫度範圍	A3 = Automotive grade (-40°C to +125°C)
ROHS版	L = true
電壓 - 電源	DWP = 1.65V-1.95V
密度配置	512M = 512M
產品系列	25 = Twin SPI Flash
Revision	= First Generation

數據表

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IS25DWP512M-CMLA3 特徵

Industry Standard Serial Interface
Efficient Read and Program modes
- IS25DLP/DWP512M: 512Mbit/64Mbyte - Dual Die Stack of two IS25LP/WP256D - Supports standard SPI and QPI protocols - Double Transfer Rate (DTR) : SPI DTR, Dual I/O SPI DTR , and Quad I/O SPI DTR - Low Instruction Overhead Operations - QPI for reduced instruction overhead - Continuous Read 8/16/32/64-Byte Burst Wrap - Selectable burst length - Supports Serial Flash Discoverable
Low Power with Wide Temp. Parameters (SFDP)
- Support Hardware RESET# Feature
High Performance Serial Flash (SPI)
- 80MHz Normal Read - Up to166Mhz Fast Read: -166MHz at Vcc=2.7V to 3.6V (1) -133MHz at Vcc=2.3V to 3.6V -133MHz at Vcc=1.65V to 1.95V (2) - Up to 80MHz DTR (Dual Transfer Rate) - Equivalent Throughput of 664 Mb/s - Selectable Dummy Cycles - Configurable Drive Strength - Supports SPI Modes 0 and 3 - More than 100,000 Erase/Program Cycles - More than 20-year Data Retention
Flexible & Efficient Memory Architecture
- Chip Erase with Uniform: Sector/Block Erase (4/32/64 Kbyte) - Program 1 to 256 bytes per page per die - Program/Erase Suspend & Resume Ranges - Single Voltage Supply IS25DLP: 2.30V to 3.60V IS25DWP: 1.65V to 1.95V - 10 mA Active Read Current per die - 8 µA Standby Current per die - 1 µA Deep Power Down per die - Temp Grades: Extended: -40°C to +105°C Auto Grade (A2): -40°C to +105°C Auto Grade (A3): -40°C to +125°C
Advanced Security Protection
- Software and Hardware Write Protection - Power Supply lock protect - 4x256-Byte dedicated security area per die with user-lockable bits, (OTP) One Time Programmable Memory - 128 bit Unique ID for each device (Call Factory)

概觀

This document contains for the IS25DLP/DWP512M device. The device is a dual die stack of two IS25LP/WP256D dies. For detailed specifications, please refer to the discrete die datasheet linked below.

IS25DWP512M-CMLA3 特徵

概觀

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